SK Hynix M15X factory imports equipment two months ahead of schedule to accelerate HBM chip production expansion

According to Korean media "TheElec", SK Hynix has installed the first batch of equipment in the new wafer fab M15X, two months ahead of schedule.

According to reports, SK Hynix originally expected to start entering equipment in December, and the early execution may be to expand the pace of high-bandwidth memory (HBM) production capacity expansion.

SK Hynix invested more than KRW 20 trillion in building M15X. The factory is located near M15 and focuses on the production of 1b DRAM, which is used as the core chip of HBM3E.

Sources revealed that the M15X’s initial monthly production capacity is 35,000 wafers, and is expected to expand to 55,000 to 60,000 wafers in the future. SK Hynix began ordering equipment for the factory at the end of last year. Some DRAM employees from the Icheon factory in South Korea have been transferred to the new Chungju factory to assist in installing equipment and preparing for mass production.

M15X has a larger clean room than the existing factory because the HBM process requires higher space and equipment capacity than traditional DRAM. Sources said that in addition to the M15X, SK Hynix is ​​also simultaneously preparing for a new Yongin plant and an advanced packaging plant in Indiana, USA.

SK Hynix announced last month that it had completed the development of HBM4 and was ready for mass production.

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