Zhending SEMICON reveals PCB cross-semiconductors! Once again, we will work on researching and creating AI smart manufacturing park

The annual global semiconductor conference SEMICON Taiwan 2025 officially debuted today. Zhending-KY participated in the exhibition this year as "PCB crosses the semiconductor industry". Chairman Shen Qingfang said that the world is at the critical moment of data explosion and computing power increase. This participation symbolizes Zhending-KY, led by PCB, has further become an important driving force in the semiconductor industry chain, injecting energy into the development of AI applications.

Shen Qingfang said that according to the latest "Evolution Computing Power Cooperation White Paper" of the Global Computing Alliance, the global computing power scale in 2021 is 615E FLOPS, which will grow to 56Z FLOPS in 2030, with an annual synthesis growth rate of up to 65.1%. It shows that computing power has become the core engine of driving industry development.

Shen Qingfang pointed out that AI is an important driving force for promoting the growth of PCB industry. With the continuous evolution of semiconductor processes, PCB undertakes the key task of supporting high-performance applications. The technology of SEMICON this time includes 28-layer high-level loading boards, 138 x138mm super large loading boards, HLC+HDI specially designed for AI servers, etc., all of which are to respond to the urgent market demand for high-speed transmission and high-performance computing. 

Shen Qingfang further pointed out that with the improvement of chip complexity and the popularization of 3D packaging, PCB is no longer just a circuit load, but an important link to determine whether computing power can be fully released. In particular, many AI applications have strict requirements on PCBs for high frequency, high speed, high density, high reliability and low energy consumption. A single process is difficult to meet the needs.

Shen Qingfang believes that how to integrate different processes such as high-level IC loading, high-level HDI/MSAP loading, HLC thick large boards will become the key to the breakthrough in performance. Zhending will take "One ZDT" as the core and comprehensively lay out the "cloud, tube, and end" applications in the AI ​​era, provide customers with the most complete solutions, and use the advantages of vertical integration and layout of AI PCB products to open up the gap with the same industry. 

Shen Qingfang shared that Zhending has actively promoted AI intelligent manufacturing and green digital transformation, and has achieved multi-faceted results in digital transformation. It has been introduced into the R&D energy management platform and shared solutions and construction experience of smart parks and carbon management platforms. These achievements are not only an improvement in the energy reduction of carbon, but also Zhending’s commitment to sustainable ESG.

R&D Chairman Liu Kezhen said that as the leader of the PCB industry and an important partner in the long-term, Zhending promoted the digitalization, intelligence, and green transformation of PCB manufacturing. Starting from early data visualization and energy management cooperation, it gradually expanded to more comprehensive smart factory applications.

Liu Kezhen pointed out that in the future, R&D will continue to share relevant experiences in introducing AI technology in Linkou and Kunshan factories, and seek cooperation with Zhending's line Edge AI and AI Agent. I believe that the in-depth cooperation between the two parties will not only establish a new classic of wisdom and green manufacturing, but will also bring long-term value to the entire industry. 

Shen Qingfang emphasized that Zhending will continue to focus on "One ZDT", integrate global resources and R&D energy, expand its layout in the dual fields of PCB and semiconductors, and enter a semiconductor from PCB to an important milestone for Zhending itself, and is a key machine to promote the upgrading of the entire PCB industry.

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